The global Automotive System ICs market was valued at US$ 51979 million in 2025 and is anticipated to reach US$ 77991 million by 2032, at a CAGR of 5.6% from 2026 to 2032.
Automotive system ICs refer to a collection of integrated circuits designed for automotive vehicles and in-vehicle electronic systems, meeting automotive-grade reliability and functional safety requirements. The statistical scope covers three main categories: Logic Devices (automotive computing and control ICs, such as MCUs/MPUs/SoCs), Memory Devices (automotive storage ICs, such as NOR/NAND/DRAM/EEPROMs), and Analog/RF/Power ICs (automotive analog/RF/power ICs, including signal chains and AFEs, drivers and isolation). The scope excludes sensors/optoelectronic devices (such as MEMS, image sensors, LEDs/lasers) and power discrete devices/power modules (such as Si/SiC MOSFETs and IGBT modules).
The core growth logic of the automotive system ICs market has shifted from "traditional ECU quantity-driven" to "electrification and intelligent computing and power architecture-driven." In the electrification trend, high-voltage systems such as OBCs, DC-DC converters, BMSs, and electric drive inverters have significantly increased the usage and value density of Analog/Power ICs for vehicle power management, isolation, gate driving, and sampling AFEs. Simultaneously, the evolution of automotive electrical architecture from distributed ECUs to domain control/centralized computing has made Logic Devices (high-performance SoCs, domain control MCUs, etc.) and Memory Devices (DRAM, NAND/NOR) another main driver of increased semiconductor content per vehicle.
On the supply side, the competitive factors for automotive system ICs are expanding from single-device performance to "platformization and system solution capabilities." For example, SBCs (System Base Chips) highly integrate functions such as power supply, monitoring, watchdog timers, and vehicle network interfaces, reducing the complexity of vehicle wiring harnesses and BOMs. At the same time, the rising thresholds for functional safety (ASIL targets), cybersecurity, and automotive-grade reliability verification have made product certification, quality systems, mass production consistency, and failure mechanism control decisive barriers for leading manufacturers. New entrants that lack platformization, certification, and experience in adoption by OEMs/Tier 1 suppliers often find it difficult to achieve large-scale substitution in mid-to-high-end models.
This report delivers a comprehensive overview of the global Automotive System ICs market, with both quantitative and qualitative analyses, to help readers develop growth strategies, assess the competitive landscape, evaluate their position in the current market, and make informed business decisions regarding Automotive System ICs. The Automotive System ICs market size, estimates, and forecasts are provided in terms of revenue (US$ millions), with 2025 as the base year and historical and forecast data for 2021–2032.
The report segments the global Automotive System ICs market comprehensively. Regional market sizes by Type, by Application, by Function, and by player are also provided. For deeper insight, the report profiles the competitive landscape, key competitors, and their respective market rankings, and discusses technological trends and new product developments.
This report will assist Automotive System ICs manufacturers, new entrants, and companies across the industry value chain with information on revenues, sales volume, and average prices for the overall market and its sub-segments, by company, by Type, by Application, and by region.
Market Segmentation
By Company
Infineon Technologies
STMicroelectronics
Texas Instruments
Toshiba
ROHM Semiconductor
NXP Semiconductors
Renesas Electronics
ADI
Microchip
NVIDIA
Mobileye
Hisilicon
Horizon Robotics
Black Sesame Intelligent Technology
onsemi
Silicon Labs
BYD Semiconductor
Micron Technology
Samsung
SK Hynix Semiconductor
ISSI (Integrated Silicon Solution Inc.)
KIOXIA
Western Digital
Nanya Technology
Winbond
GigaDevice
Macronix
Giantec Semiconductor
Intel Corporation
Qualcomm
Broadcom
Nexperia
Diodes Incorporated
Monolithic Power Systems
Qorvo
SGMICRO
Silergy
Southchip Semiconductor Technology Co., Ltd
Power Integrations
MediaTek
Skyworks Solutions
NOVOSENSE Microelectronics
3Peak Incorporated
Nisshinbo
AutoChips
ChipON
GigaDevice
Nuvoton
Indie Microelectronics
Suzhou Flagchip Semiconductor Co., Ltd
Geehy Semiconductor
Jiangsu YUNTU
Nations Technologies Inc
Cmsemicon
CHIPWAYS
C*Core Technology Co., Ltd
LINKO SEMICONDUCTOR
SemiDrive
Shanghai MindMotion Microelectronics
SinoWealth
Shanghai Belling Corp., Ltd
OmniVision
Dosilicon Co., Ltd
Segment by Type
Logic Devices
Memory Devices
Analog/Power IC
Segment by Function
MCU
SoC
NOR/NAND Flash
DRAM
SRAM/EEPROM
Power Management IC
Driver IC
Signal Chain IC
Others
Segment by Application
Automotive Powertrain/Electric Drive Systems
Automotive Charging and Power Sources
Automotive Batteries
Automotive Chassis
Automotive Body and Comfort Systems
Automotive Networks and Gateways
ADAS/Autonomous Driving
Automotive Sensing Radar/Cameras
Automotive Infotainment
Other
By Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia & New Zealand
Rest of Asia
Europe
Germany
France
U.K.
Italy
Ireland
Russia
Rest of Europe
Latin America
Mexico
Brazil
Argentina
Rest of Latin America
Middle East & Africa
Israel
United Arab Emirates (UAE)
Saudi Arabia
Rest of MEA
Chapter Outline
Chapter 1: Defines the scope of the report and presents an executive summary of market segments (by Type, by Application, by Function, etc.), including the size of each segment and its future growth potential. It offers a high-level view of the current market and its likely evolution in the short, medium, and long term.
Chapter 2: Summarizes global and regional market size and outlines market dynamics and recent developments, including key drivers, restraints, challenges and risks for industry participants, and relevant policy analysis.
Chapter 3: Provides a detailed view of the competitive landscape for Automotive System ICs companies, covering revenue share, development plans, and mergers and acquisitions.
Chapter 4: Analyzes segments by Type, detailing the size and growth potential of each segment to help readers identify blue-ocean opportunities.
Chapter 5: Analyzes segments by Application, detailing the size and growth potential of each downstream segment to help readers identify blue-ocean opportunities.
Chapter 6–10: Regional deep dives (North America, Europe, Asia Pacific, Latin America, Middle East & Africa) broken down by country. Each chapter quantifies market size and growth potential by region and key countries, and outlines market development, outlook, addressable space, and capacity.
Chapter 11: Profiles key players, presenting essential information on leading companies, including product/ service offerings, revenue, gross margin, product introductions/portfolios, recent developments, etc.
Chapter 12: Key findings and conclusions of the report.